BS IEC 62047-27:2017
Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
- Standard No.
- BS IEC 62047-27:2017
- Release Date
- 2020
- Published By
- British Standards Institution (BSI)
- Latest
- BS IEC 62047-27:2017
- Scope
- What is BS IEC 62047 ‑ 27 - Micro-chevron-tests (MCT) for semiconductor devices about? BS IEC 62047 is an international standard that discusses semiconductor devices including microelectromechanical devices. The main aim of the IEC 62047 series is to provide entities involved with semiconductor technology with best industry techniques to demonstrate the reliability and performance of their devices and components. BS IEC 62047 ‑ 27 specifies a method for assessing the bond strength of glass frit bonded structures ...
BS IEC 62047-27:2017 history
- 2020 BS IEC 62047-27:2017 Semiconductor devices. Micro-electromechanical devices - Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
