SJ/T 10705-1996
Standard practice for inspection of surface quality of semiconductor lead-bonding wire (English Version)

Standard No.

SJ/T 10705-1996

Language

Chinese, Available in English version

Release Date

1996

Published By

Professional Standard - Electron

Status

Withdraw 2010-02

Latest

SJ/T 10705-1996

Scope

This standard specifies the surface quality inspection method for semiconductor device bonding wires. This standard is applicable to the inspection of surface quality of various bonding wires.

SJ/T 10705-1996 history

• 1996 SJ/T 10705-1996 Standard practice for inspection of surface quality of semiconductor lead-bonding wire