QJ/Z 159.2-1985
Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies (English Version)
- Standard No.
- QJ/Z 159.2-1985
- Language
- Chinese, Available in English version
- Release Date
- 1985
- Published By
- Professional Standard - Aerospace
- Status
- Replace By
- QJ 3258-2005
- Latest
- QJ 3258-2005
QJ/Z 159.2-1985 history
- 1970 QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products
- 1985 QJ/Z 159.2-1985 Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies
QJ/Z 159.2-1985 Detailed Rules for Potting and Sealing Process of Printed Circuit Board Assemblies was changed to QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products.
