HG/T 3592-1999
Copper sulfate for electroplating use (English Version)
- Standard No.
- HG/T 3592-1999
- Language
- Chinese, Available in English version
- Release Date
- 1999
- Published By
- Professional Standard - Chemical Industry
- Status
- 2011-03
- Replace By
- HG/T 3592-2010
- Latest
- HG/T 3592-2020
- Scope
- This standard specifies the requirements, test methods, inspection rules, signs, labels, packaging, transportation and storage of copper sulfate for electroplating. This standard applies to copper sulfate for electroplating. This product is mainly used for electroplating copper, electroplating brass, and electroless copper plating. Molecular formula: CuSO|(4)·5H|(2)O Relative molecular mass: 249.68 (according to the 1995 international relative atomic mass)
HG/T 3592-1999 history
- 2020 HG/T 3592-2020 Copper sulfate for electroplating
- 2010 HG/T 3592-2010 Copper sulfate for electroplating use
- 1999 HG/T 3592-1999 Copper sulfate for electroplating use
