SJ 2425-1983
Methods for tensile testing of fine metal wires (English Version)

Standard No.

SJ 2425-1983

Language

Chinese, Available in English version

Release Date

1983

Published By

Professional Standard - Electron

Latest

SJ 2425-1983

Scope

This standard is applicable to the normal temperature static tensile test method for metal and alloy filaments with a diameter equal to or less than 0.12 mm used for semiconductor device bonding wires.

SJ 2425-1983 history

• 1983 SJ 2425-1983 Methods for tensile testing of fine metal wires