This standard specifies the technical requirements, test methods, inspection rules, marking, packaging, transportation and storage of vacuum ion plating equipment. This standard is applicable to vacuum ion plating equipment with a pressure in the range of 10^(-4)~10^(-3)Pa, specifically including the following types: multi-arc ion plating, arc discharge vacuum ion plating, hollow cathode ion plating (HCD) ), radio frequency ion plating (RFIP), direct current discharge diode type (DCIP), multi-cathode type, active reactive evaporation plating (ARE), enhanced ARE, low pressure plasma ion plating (LFPD), electric field evaporation ion plating, induction heating Ion plating, cluster ion beam plating, etc. Note: Ion plating uses gas discharge to partially separate the gas or evaporated material under vacuum conditions, and deposits the evaporated material or its reactants on the substrate while being bombarded by gas ions or evaporated material ions.