CNS 13725-1996
Method of Nondestructive Test for Microelectronic Wire Bonds (English Version)
- Standard No.
- CNS 13725-1996
- Language
- Chinese, Available in English version
- Release Date
- 1996
- Published By
- Taiwan Provincial Standard of the People's Republic of China
- Latest
- CNS 13725-1996
- Scope
- 1.1 This standard applies to non-destructive testing of individual bonding wires of microelectronic components. The wire bonding technology can be ultrasonic, hot pressing or thermosonic. This standard is designed to avoid damage to acceptable wire bonds that would be destructive to unacceptable wire bonds. Notes 1. The term "bonding wire" here refers to the entire wiring, including the two welding points and the wires spanning between them. 2. After this tensile test
CNS 13725-1996 history
- 1996 CNS 13725-1996 Method of Nondestructive Test for Microelectronic Wire Bonds
