PN-EN IEC 60749-20-2021-06 E
Semiconductor devices -- Mechanical and climatic test methods -- Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020)

Standard No.

PN-EN IEC 60749-20-2021-06 E

Release Date

2021

Published By

PL-PKN

Replace By

PN-EN 60749-20-2010 E