JIS Z 3284-4:2014
Solder paste -- Part 4: Test methods for wettability, solderball and spread

Standard No.

JIS Z 3284-4:2014

Release Date

2014

Published By

Japanese Industrial Standards Committee (JISC)

Latest

JIS Z 3284-4:2014

Replace

JIS Z 3284:1994

JIS Z 3284-4:2014 Referenced Document

• JIS C 0099 Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
• JIS H 3100 
• JIS K 8034 Acetone
• JIS K 8180 Hydrochloric acid (Reagent)*， 2021-02-22 Update
• JIS K 8839 2-Propanol (Reagent)
• JIS R 6252 Abrasive papers*， 2022-03-22 Update
• JIS Z 3001 Welding terms
• JIS Z 3197 Test methods for soldering fluxes*， 2021-03-22 Update
• JIS Z 3284-1 Solder paste.Part 1: Kinds and quality classification

JIS Z 3284-4:2014 history

• 2014 JIS Z 3284-1:2014 Solder paste.Part 1: Kinds and quality classification
• 1994 JIS Z 3284:1994 Solder paste