JEDEC JESD22B113A-2012
Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of SMT ICs for Handheld Electronic Products
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JEDEC JESD22B113A-2012
Standard No.
JEDEC JESD22B113A-2012
Release Date
2012
Published By
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
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