QJ 2829A-2011
General technical requirements for encapsulation and bonding of aerospace electronic products (English Version)

Standard No.

QJ 2829A-2011

Language

Chinese, Available in English version

Release Date

2011

Published By

Professional Standard - Aerospace

Replace

QJ 2829-1996

Scope

This standard specifies the general technical requirements and quality requirements for potting and bonding of aerospace electronic and electrical products. This standard is applicable to the potting and bonding of aerospace electronic and electrical products, and can be used as a basis for design, production, and inspection.

QJ 2829A-2011 Referenced Document

• QJ 165A-1995 General technical requirements for installation of aerospace electronic and electrical products
• QJ 2711 Technical requirements for installation process of electrostatic discharge sensitive devices
• QJ 2850 Aerospace Product Surplus Prevention and Control
• QJ 3014-1998 Polysulfide rubber potting process technical requirements for aerospace electronic and electrical products
• QJ 3215-2005 Epoxy resin sticking technical requirements for space electron element
• QJ 3258-2005 Technical requirements for silicone rubber bonding and potting of aerospace electronic and electrical products
• QJ 977 复合材料

QJ 2829A-2011 history

• 1996 QJ 2829-1996 General technical requirements for potting and bonding of aerospace electronic and electrical products

QJ 2829A-2011 General technical requirements for encapsulation and bonding of aerospace electronic products has been changed from QJ 2829-1996 General technical requirements for potting and bonding of aerospace electronic and electrical products.