ANSI/GEIA STD-0006-2008
Requirements for Using Solder Dip to Replace the Finish on Electronic Components

Standard No.: ANSI/GEIA STD-0006-2008
Release Date: 2008
Published By: American National Standards Institute （ANSI)

Scope: This document defines a specification using hot solder dip to replace the finish on electronic components. It also includes qualification procedures, technical specifications of the actual process, and mandatory testing to ensure successful application of the hot-dipped coating.

ANSI/GEIA STD-0006-2008 -All Parts

ANSI/GEIA STD-0001-2006 IBIS Interconnect Modeling Specification (ICM) ANSI/GEIA STD-0003-2006 Procedures for Long Term Storage of Electronic Devices ANSI/GEIA STD-0005-1-A-2012 Standard for Managing the Use of Pb-Free Solder and Finishes in Aerospace, Defense and High Performance Electronic Systems ANSI/GEIA STD-0005-2-A-2012 Standard for Mitigating the Effects of Tin Whiskers in Aerospace and High Performance Electronic Systems ANSI/GEIA STD-0005-3-A-2013 Performance Testing for Aerospace and High Performance Electronic Interconnects Containing Pb-free Solder and Finishes ANSI/GEIA STD-0007-A-2010 Logistics Data Implementation Model ANSI/GEIA STD-0008-2012 Derating of Electronic Components ANSI/GEIA STD-0009-2008 Reliability Program Standard for Systems Design, Development and Manufacturing ANSI/GEIA STD-0010-2009 Standard Best Practices for System Safety Program Development and Execution ANSI/GEIA STD-927-A-2011 Common Data Schema for Complex Systems

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