(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
The methodology presented in this document, see Annex A for process flow, is applicable for
studying tin whisker growth from finishes containing a predominance of tin (Sn). This test
method may not be sufficient for applications with special requirements, e.g., military or aerospace.
Additional requirements may be specified in the appropriate requirements document.
The purpose of this standard is to:
• Provide an industry-standardized suite of tests for measurement and comparison of whisker
propensity for different plating or finish chemistries and processes.
• Provide a consistent inspection protocol for tin whisker examination.
• Provide a standard reporting format.
JEDEC JESD22A121A-2008 Referenced Document
IPC 7530 Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow& Wave)
JEDEC JESD201 Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes