ARMY MIL-C-47224 B-1993
COMPOUND MOLDING, TRANSFER, EPOXY RESIN, SINGLE-COMPONENT

Standard No.

ARMY MIL-C-47224 B-1993

Release Date

1993

Published By

U.S. Military Regulations and Norms

Scope

This specification covers one type of singlecomponent, epoxy resin transfer molding compound for encapsulating, potting, and embedding electrical devices requiring good thermal conductivity.