Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
The purpose of this test method is to provide a
consistent procedure to test the sensitivity of electronic components
to ultrasonic energy. There has been reluctance in
the electronics industry to use ultrasonic energy for printed
board assembly cleaning because of the possibility of damage
to wire bonds in active, hermetically sealed components or
other damage that might cause latent failures.
Recent work has shok that electronic components have a
low potential for damage from ultrasonics (References 1-7)
under conditions seen in most cleaning proceCCes. In addition,
MlL-SlD-2000 Rev. A and J-Sp-001 now allow for the
use of'ultrasonic cleaning, as does the proposal for IEC TC91
International Standards based on an updated revision of the
J-STD-001,