Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
The purpose of this test method is to provide a consistent
procedure to test the sensitivity of electronic components to
ultrasonic energy. There has been a reluctance in the electronics
industty to use ultrasonic energy for printed board
assemblies cleaning because of the possibility of damage to
wire bonds in active, hermetically sealed components or other
damage that might cause latent failures.
Recent work has shown that electronic components have a
low potential for damage from ultrasonics (See 6.1) under
conditions seen in most cleaning processes. In addition, MILSTD-
2000 Rev. A and J-STD O01 nbw allow for the use of
ultrasonic cleaning, as does the proposal for IEC TC91 International
Standards based on an updated revision of the
J-STD-001