Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This general design guide for Printed Board Backplanes is
based upon the primary understanding that the individual
using this IPC document as a reference and guide has the
basic mechanical knowledge of the various types of interconnection
systems. Also, that the electrical and mechanical
properties of the interconnection materials have already
been evaluated and selected by the individual companies’
components specification organizations and are approved.