IPC TR-579-1988
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards
- Standard No.
- IPC TR-579-1988
- Release Date
- 1988
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Scope
- The "Round Robin Reliability Evaluation of Small Diameter Plated ThroughH oles (PTH) in Printed Wiring Boards" had the following objectives:
