Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
With the present packaging trend in system design
moving towards compact, low power consumption configurations,
the use of Surface Mount Technology offers a viable
approach toward achieving the desired packaging goals. Sophisticated
electronic assemblers, using a variety of interconnection
and packaging techniques, employ the best of todays
technology, intermixed with the appropriate sfate-of-the-art
component and attachment processes. The degree of advancement
in packaging of electronic components is predicated
on the type of product being produced: the need for
miniaturization and weight savings; plus the off-the-shelf availability
of different component types.