IPC TM-650 2.3.24.1-1985
Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method

Standard No.

IPC TM-650 2.3.24.1-1985

Release Date

1985

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This standard establishes requirements and other considerations