IPC TM-650 2.3.23-1988
Cure (Permanency) Thermally Cured Solder Masks; Revision B - February 1988
- Standard No.
- IPC TM-650 2.3.23-1988
- Release Date
- 1988
- Published By
- Institute of Interconnecting and Packaging Electronic Circuits (IPC)
- Status
- Scope
- This specification covers the requirements for high speedíhigh frequency base materials, herein referred to as laminate or bonding layer, to be used primarily for the fabrication of rigid or multilayer printed boards for high speedhigh frequency electrical and electronic circuits. This specification applies to material thickness defined in the specification sheets as measured over the dielectric only
