IPC TM-650 2.2.21-1998
Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology

Standard No.

IPC TM-650 2.2.21-1998

Release Date

1998

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

ADDENDUM II Phase 111 Report Testing Laminates Used in the Manufacture of Multilayer Boards-Dimensional Stability Following Lamination Simulation