IPC TM-650 2.2.14.3-1995
Determination of Maximum Solder Powder Particle Size

Standard No.
IPC TM-650 2.2.14.3-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
The ad hoc team choose to use the round robin approach to quantitatively measure the . effects of each variable at several levels. The round robin was developed and executed as a joint effort to minimize disagreements and maximize accuracy. The Steam Aging Round Robin was developed and approved by June 1989 (see Appendix A).



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