Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
Material in this document was voluntarily established by
the members of a special task group of the IPC formed to
evaluate solder coatings. This material is advisory only
and its use or adaptation is entirely voluntary. The IPC
disclaims all liabilityo f any kind as to the use, application,
or adaptation of this material. Users are also wholly
responsible for protecting themselves against all claims
or liabilities for patent infringement