IPC TM-650 2.3.15-2004
Purity, Copper Foil or Plating Revision D

Standard No.
IPC TM-650 2.3.15-2004
Release Date
2004
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for Electrical and Electronic Equipment (EEE). This standard applies to products, components, subitems and materials that are supplied to producers of EEE for incorporation into their products. It does not apply to packaging materials (e.g. cardboard, plastic tray). It covers materials and substances that may be present in the supplied product or subitem. It does not apply to process chemicals, unless those process chemicals constitute part of the finished product or subitem.



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