IPC J-STD-027-2003
Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Standard No.

IPC J-STD-027-2003

Release Date

2003

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.