IPC J-STD-026-1999
Semiconductor Design Standard for Flip Chip Applications IPC/EIA J-STD-026

Standard No.

IPC J-STD-026-1999

Release Date

1999

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Status

Withdraw

Scope

This standard addresses semiconductor chip design. It is intended for applications utilizing standard substrates, materiais, assembly, and test methods as well as established semiconductor fabrication and bumping processes.