Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
Material in this standard was voluntarily coordinated by the Surface Mount Council
(SMC), and established by Technical Committees of IPC and EIA. Committee
members of the two organizations contributed their time, knowledge and expertise
to blend a cohesive report on the topic covered by this document. Proposals were
sent to key individuals in each of the individual organizations for consensus.
Meetings were held to resolve differences or conflicts prior to documenting the
information in the final released version.