IPC TM-650 2.5.5.4-1985
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material-Micrometer Method

Standard No.
IPC TM-650 2.5.5.4-1985
Release Date
1985
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This standard specifies the XML schema that represents the intelligent data file format used to describe printed board and printed board assembly products with details sufficient for tooling, manufacturing, assembly, and inspection requirements. This format may be used for transmitting information between a printed board designer and a manufacturing or assembly facility. The data is most useful when the manufacturing cycle includes computer-aided processes and numerical control machines.



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