IPC TM-650 2.5.5.2-1987
Dielectric Constant and Dissipation Factor of Printed Wiring Board Material - Clip Method

Standard No.
IPC TM-650 2.5.5.2-1987
Release Date
1987
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This standard defines an XML encoding scheme that captures the configuration data from manufacturing operations. The IPC-2576 standard defines how manufacturing product genealogy information is exchanged between supply chain partners. Information represented in this standard includes such things as: manufacturing site, manufacturing date, part number, serial number, manufacturing batch/lot, component and sub-assembly data.



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