Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This standard establishes the requirements for a distinctive
symbol and labels to be used to identify materials that are
lead-free (Pb-free) and are capable of providing Pb-free 2nd
level interconnects, and for indicating certain types of
Pb-free material and the maximum assembly temperature.
It also establishes the requirements for labeling a bare board
if the base resin is halogen free and the type of conformal
coating used after assembly.