IPC TM-650 2.4.34.2-1995
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)

Standard No.
IPC TM-650 2.4.34.2-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This handbook has been developed to aid Printed Circuit Board manufacturers and users of Printed Circuit Boards in completing Material Declarations that follow the format and guidance of the Joint Industry Material Composition Declaration Guide for Electronic Products.



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