IPC CA-821-1995
General Requirements for Thermally Conductive Adhesives

Standard No.
IPC CA-821-1995
Release Date
1995
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Scope
This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.
General Requirements for Thermally Conductive Adhesives



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