IPC 2517A-2000
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description [ASEMT]

Standard No.

IPC 2517A-2000

Release Date

2000

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Scope

This standard specifies data formats used to describe printed board assembly in-circuit testing methodologies. These formats may be used for transmitting information between printed board designers, board fabricators, and assembly manufacturers. The formats are also useful when the manufacturing cycle includes computer-aided processes and numerical control machines.