IPC TM-650 2.6.3.1-2007
Solder Mask - Moisture and Insulation Resistance Revision E

Standard No.
IPC TM-650 2.6.3.1-2007
Release Date
2007
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
This document defines standard methodologies for calculating defects per million opportunities (DPMO) metrics related to electronic printed board assembly processes. It is intended for use in measuring in-process assembly steps rather than end product determination. Calculation of completed item DPMO is addressed in IPC- 7912.



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