IPC TM-650 2.4.29-2007
Solder Mask - Adhesion to Flexible Circuits Revision C

Standard No.

IPC TM-650 2.4.29-2007

Release Date

2007

Published By

Institute of Interconnecting and Packaging Electronic Circuits (IPC)

Status

Withdraw

Scope

ADDENDUM II Phase 111 Report Testing Laminates Used in the Manufacture of Multilayer Boards-Dimensional Stability Following Lamination Simulation