IPC TM-650 2.4.28.1-2007
Solder Mask Adhesion - Tape Test Method Revision F

Standard No.
IPC TM-650 2.4.28.1-2007
Release Date
2007
Published By
Institute of Interconnecting and Packaging Electronic Circuits (IPC)
Status
Scope
Shown above are the experts who participated i n the panel discussion on t h i n copper foils. The entire program covered i n this report was developed by Program Chairman Bernard A7 zua , CuTronics.



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