TIA J-STD-028-1999
Performance Standard for Construction of Flip Chip and Chip Scale Bumps IPC/EIA J-STD-028

Standard No.

TIA J-STD-028-1999

Release Date

1999

Published By

(U.S.) Telecommunications Industries Association 

Scope

This standard establishes the construction detail requirements for bumps and other terminal structures on flip chips and chip scale carriers.