JEDEC JESD51-11-2001
Test Boards for Through-Hole Area Array Leaded Package Thermal Measurements

Standard No.

JEDEC JESD51-11-2001

Release Date

2001

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification covers through-hole area array leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets.