JEDEC JESD51-10-2000
Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements

Standard No.

JEDEC JESD51-10-2000

Release Date

2000

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This specification covers through-hole mount perimeter leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets or PGA packages.