JEDEC JESD51-8-1999
Integrated Circuit Thermal Test Method Environmental Conditions - Junction-to-Board

Standard No.

JEDEC JESD51-8-1999

Release Date

1999

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This standard specifies the environmental conditions necessary for determining the junction-to-board thermal resistance, Rejo, and defines this term. The bJBthen nal resistance is a figure of merit for comparing the thermal performance of surface mount packages mounted on a standard board. This specification should be used in conjunction with the overview document JESD5 1, “Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)” [i] and the electrical test procedures described in EINJESDS 1- 1, “Integrated Circuit Thermal Measurement Method (Single Semiconductor Device)“ [2]. The environmental conditions described in this document are specifically designed for testing of integrated circuit devices that are mounted on standard test boards with two internal copper planes [3]. This standard is not applicable to packages that have asymmetric heat flow paÍhs io the printed circuit board causeá by such thermai enhancements as fused ieacis (ieads connecteci to the die pad) or power style packages with the exposed heat slug on one side of the package.