(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
JEDEC Standard No. 2 should be of g r e a t v a l u e to both manufact
u r e r s and u s e r s o f d i g i t a l bipolar logic devices who need t o
be able to c o n v e r t e x i s t i n g d u a l - i n - l i n e (DIP) package pin
functions and locations t o appropriate chip carrier package
f orrnat s