JEDEC JESD51-1995
Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)

Standard No.

JEDEC JESD51-1995

Release Date

1995

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Scope

This document provides an overview of the methodology necessary for making meaningful thermal measurements on packages containing single chip semiconductor devices. The actual methodology components are contained in separate detailed documents.