JEDEC JESD22A121.01-2005
Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes

Standard No.

JEDEC JESD22A121.01-2005

Release Date

2005

Published By

(U.S.) Joint Electron Device Engineering Council Soild State Technology Association

Status

Withdraw

Scope

The predominant terminal finishes on electronic components have been Sn-Pb alloys. As the industry moves toward Pb-free components and assembly processes, the predominant terminal finish materials will be pure Sn and alloys of Sn, including Sn-Bi and Sn-Ag.