JEDEC JESD22A111-2004
Evaluation Procedure for Determining Capability to Bottom Side Board Attach by Full Body Solder Immersion of Small Surface Mount Solid State Devices
- Standard No.
- JEDEC JESD22A111-2004
- Release Date
- 2004
- Published By
- (U.S.) Joint Electron Device Engineering Council Soild State Technology Association
- Status
- Scope
- This evaluation procedure is written to provide USER’s of ICs of small surface mount packages with a method to evaluate the capability of a component to withstand full wave solder immersion.
