(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
This document describes a test method only; acceptance criteria and qualification requirements
are not defined. This test method applies to solder ball pull force testing prior to end-use
attachment. Solder balls are pulled individually using mechanical jaws; force and failure mode
data are collected and analyzed. Other specialized solder ball pull methods using a heated
thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document.
Both low and high speed testing are covered by this document.