JEDEC JESD22-B113-2006 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of
surface mount electronic components in an accelerated test environment for handheld electronic products
applications. The purpose is to standardize the test methodology to provide a reproducible performance
assessment of surface mounted components while duplicating the failure modes normally observed during
product level test. This is not a component qualification test and is not meant to replace any product level
test that may be needed to qualify a specific product and assembly.