(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Scope
This test method applies to semiconductor devices that are subjected to temperature
excursions and required to power on and off during all temperatures. The power and
temperature cycling test is performed to determine the ability of a device to withstand
alternate exposures at high and low temperature extremes with operating biases
periodically applied and removed. It is intended to simulate worst case conditions
encountered in typical applications.