(U.S.) Joint Electron Device Engineering Council Soild State Technology Association
Status
Scope
This specification applies to single, dual and triple chamber temperature cycling and covers
component and solder interconnection testing. In single chamber cycling, the load is placed in a
stationary chamber, and is heated or cooled by introducing hot or cold air into the chamber. In
dual chamber cycling, the load is placed on a moving platform that shuttles between stationary
chambers maintained at fixed temperatures. In triple chamber temperature cycling there are
three chambers and the load is moved between them.