This standard specifies the method principle, reagents, instruments, analysis steps and calculation of analysis results for the determination of sulfuric acid (ρ1.84g/ml) content in electroplating copper passivation solution using potentiometric titration. This standard is applicable to the determination of sulfuric acid content in copper electroplating passivation solution. Measuring range: 20~35g/L.
HB/Z 5109.10-2001 history
2001HB/Z 5109.1-2001 Analysis method for passivation solution Determination of sodium bichromate content in zinc plating, cadmium plating diacid passivation solution through potentiometric titration